Model:AS-261-0-02
Type:Automated Semiconductor Assembly System
Reflow Speed:Up to 1000 components per minute
Bonding Capacity:Supports fine-pitch BGA and CSP packages
Power Supply:230V, 50/60Hz
Maximum Process Temperature:450°C
Cooling System:Water-cooled for precision temperature control
Automation Level:Fully automated with operator interface
Dimensions:960mm x 1200mm x 1400mm
Weight:Approximately 1200kg
The K&S AS-261-0-02 is engineered with cutting-edge technology to deliver unparalleled precision in semiconductor assembly processes. Its compact design allows for efficient use on the factory floor, while its robust construction ensures reliability over long periods of operation.
Featuring a sophisticated bonding mechanism, this tool is capable of handling intricate micro-bonding tasks with ease, making it an indispensable asset in semiconductor fabrication. It supports a wide range of workpiece sizes, from small components to larger assemblies, ensuring flexibility across various applications.
With a process speed of up to 1200 parts per hour, the K&S AS-261-0-02 maximizes productivity without compromising on quality. Its adjustable bonding force range of 20 to 200gf ensures precise control over the assembly process, leading to superior connection strength and durability.
Temperature control is critical in semiconductor bonding, and the K&S AS-261-0-02 excels in this area, maintaining a tight tolerance of ±0.1°C throughout the process. Coupled with an ultra-high vacuum level of 99.99%, it achieves exceptional purity in the bonding environment, minimizing contamination risks.
Power efficiency is another highlight of this tool, consuming just 1500W while delivering high performance. This not only saves energy but also reduces operational costs significantly. Moreover, the ergonomic design ensures easy maintenance and hassle-free operation, contributing to a smoother workflow in the manufacturing environment.
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