Form Factor:Compact design
Operating Temperature:-40°C to +70°C
Power Consumption:≤15W
Communication Protocol:DeviceNet
Number of Inputs/Outputs:4x DI/2x DO
Dimensions:96mm x 110mm x 34mm
Weight:Approx. 145g
Experience enhanced connectivity and data exchange with the GE Fanuc IC693DNM200, a robust DeviceNet master module specifically engineered for industrial automation environments.
Featuring high-speed communication capabilities, this module ensures smooth operation and increased efficiency across multiple devices within your plant.
With support for up to 127 nodes on a single network, the IC693DNM200 maximizes your system’s scalability and flexibility, allowing for seamless integration of new components without compromising performance.
Engineered for durability, this module operates reliably within a wide temperature range, ensuring consistent performance from extreme cold to high temperatures. It’s also designed for easy storage, making it ideal for both operational use and temporary storage.
Compact and lightweight, the IC693DNM200 fits seamlessly into existing control panels or can be conveniently mounted on walls or cabinets, minimizing space requirements and enhancing your workspace organization.
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