Memory Capacity:24MB
Bus Interface:Parallel
Operating Temperature Range:-40°C to 70°C
Voltage Range:12VDC
Form Factor:Compact DIN Rail Mountable
Dimensions:51mm x 104mm x 35mm
Operating System Compatibility:Windows, Linux, Unix
The GE FANUC IC660TBD024M Memory Module boasts an impressive 24 MB of memory capacity, providing ample space for storing critical data and software in industrial control environments. It operates efficiently within a wide voltage range of 18-32 VDC, ensuring reliability across various power conditions. Designed to withstand temperatures from -20°C to +70°C, this module ensures robust performance in extreme environments. With a maximum power consumption of 150 mA, it maintains energy efficiency without compromising on functionality.
Featuring an RS-485 communication interface, the module facilitates seamless data exchange with other components in the system, enhancing operational efficiency. Its compatibility with GE Fanuc Mark VI systems and other compatible platforms ensures easy integration into existing industrial control architectures, making it a versatile choice for a wide array of applications.
Crafted with precision and durability, the GE FANUC IC660TBD024M Memory Module offers unparalleled performance, reliability, and ease of integration. Whether you’re looking to upgrade existing systems or build new ones, this memory module is your go-to solution for efficient data management and processing in industrial settings.
This module is designed with advanced technology that allows for smooth and reliable data handling in diverse industrial applications. Its compact design and high-quality materials ensure longevity and minimal maintenance requirements, reducing downtime and enhancing overall system performance.
For those seeking to optimize their industrial control systems, the GE FANUC IC660TBD024M Memory Module is an exceptional choice. It combines cutting-edge technology with practicality, offering a robust solution that meets the stringent demands of modern industrial environments.
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