Board Type:Advanced Backplane Assembly
Model Number:259B2460BTG2
Material:High-grade aluminum alloy for superior thermal conductivity and durability
Dimensions:450mm x 100mm x 10mm
Weight:Approximately 1.5kg
Data Transmission Speed:Up to 10 Gbps
Power Consumption:Low power design for energy efficiency
Operating Temperature Range:-20°C to +70°C
Compliance Standards:UL, CE, FCC certified for global compatibility
Connector Compatibility:Supports various industry-standard connectors for seamless integration
This backplane assembly board from GE is specifically engineered for compatibility with its range of industrial control modules, ensuring robust performance and longevity in harsh environments.
Crafted from high-grade aluminum alloy, it provides exceptional thermal conductivity and durability, making it ideal for high-temperature industrial applications.
Featuring a compact yet spacious design, the board supports multiple modules, facilitating easy expansion and customization of your control network.
With an operating temperature range of -40°F to 140°F (-40°C to 60°C), this board ensures reliable operation across a wide spectrum of industrial settings, from freezing cold warehouses to hot manufacturing floors.
Backed by GE’s commitment to quality and innovation, this backplane assembly board is designed to minimize downtime and maximize efficiency in your industrial automation processes.
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