Processor Type:Advanced Microcontroller
Memory Capacity:Up to 2 MB user memory
I/O Modules:Supports installation of up to Three (3) 1769 I/O modules
Communication Ports:1 Ethernet I/P; 1 RS232
Mounting:DIN Rail
Temperature Rating:Operates at -25°C to +60°C
Power Supply:12 to 60 VDC
Dimensions:9.5 x 5.5 x 1.5 inches
Weight:Approximately 1 lb
Experience unparalleled precision and efficiency with our Allen-Bradley AB 1769-L23E-QBFC1B Packaging Control Module. Designed specifically for the rigorous demands of packaging industries, this module ensures seamless integration into your existing systems, offering unparalleled control and automation capabilities.
Featuring an advanced microcontroller with ample memory capacity, it allows you to configure up to three (3) 1769 I/O modules, providing you with the flexibility to tailor your system to your specific needs.
With support for both Ethernet/IP and DeviceNet communication protocols, this module ensures robust connectivity and compatibility with a wide range of devices, enhancing operational efficiency.
Engineered for reliability, the module operates within a temperature range of -25°C to 60°C, making it suitable for various industrial environments. Its copper wire power supply ensures stable operation even under extreme conditions.
Our Allen-Bradley AB 1769-L23E-QBFC1B Packaging Control Module is not just about functionality; it’s about delivering value. With its easy DIN rail mounting and compact design, it fits seamlessly into any packaging line setup, optimizing space and improving workflow.
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